Thin Wall Packaging

May 10, 2016 Events

Taghleef Industries will attend the 5th AMI international conference on thin wall packaging.

This event offers a unique opportunity for leading manufacturing concerns, researchers, and suppliers of the industry to debate the latest developments and market trends in light weight plastics packaging. Attendees benefit from inside knowledge on Microwave, freezer, and oven-proof containers, a rapidly growing market. Enabled by these developments in manufacturing technology and barrier materials, producers can now communicate brand image to target consumers more effectively than ever before.

The event will take place on May 10-11, 2016 in the Ravinia ABC Ballroom, at The Westin Chicago North Shore in Chicago, IL, USA.

See you all there!

To see the full programme, please click here.

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Taghleef’s Dynamic Cycle™ activities in Latin America

Derprosa™ unveils new brand identity

Taghleef Industries received the 2022 Arnott’s Group Award

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