Pagina 4 - Ti_News_january2013_9

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Ta g h l e e f I n d u s t r i e s N e w s
4
USA
Pack Expo Wrap Up
Pack Expo 2012 rolled into McCormick Place in downtown Chicago during the last week of
October. Beginning on October 29 and running
through October 31, the largest packaging show
in North America showcased a wide variety of
equipment manufacturers, converters, substrate
manufacturers and other packaging industry con-
tributors. The show itself covered over 1.1 million
ft2 (102,000 m2) with almost 2,000 exhibitors displaying their products and services for slightly
over 45,000 attendees. In presenting our booth to the attendees, it was important to show that
our two organizations have come together in the Americas and expanded our global reach. The
Ti
and AET logos were paired together at the top of the booth and a global map was positioned in the front and center of the booth calling out
our combined manufacturing sites and sales offices. A space was dedicated to key market areas of Snacks, Confectionery, High Barrier (includ-
ing Extendo®), Overwrap and Baked Goods for the Flexible Packaging Group and Roll-Fed, Vision® Shrink, Injection In-Mold, Pressure Sensitive
and Cut & Stack for the Labels Group. Additionally, we included an area for sustainability to support
current business practices of reducing raw materials by making thinner films, utilizing renewable re-
sources such as PLA for Nativia® and incorporating recycled content into current films branded under
RE®. Lastly, a presentation loop detailed our combined organization, sustainability initiatives and focus
markets for our booth visitors.
In addition to the booth, invitation only hospitality events (a luncheon & a cocktail reception) were
held for further interaction with customers, allied suppliers and end-users. Each event was well at-
tended and provided an opportunity for direct interaction in a relaxed environment. During the show,
the booth volume was high with many new and existing customers looking to expand their current
business. We noticed a higher volume of international inquiries primarily from Latin America; however, most of the volume, as expected, was
from North American companies. Our visitors primarily supported the Baked Goods, Snacks, Beverage, Dairy and Confectionery markets.
IMLCON
On October 4th & 5th,
Ti
and AET jointly showcased the newly expanded offering of injection in-mold
labeling films at the 2012 IMLCON in Chicago, IL. Organized by Alexander Watson & Associates (AWA),
IMLCON is a premier annual industry conference in North America,
attended by key global organizations utilizing decorating technologies
such as Injection In-Mold, Extrusion BlowMold, and In-Mold Decorating
for durable goods. 
The conference provides excellent networking opportunities to a
focused industry group. Up-to-date market information and data
supporting both new and trending technologies in this emerging market were presented over both
days of the conference. As a sponsor of IMLCON,
Ti
and AET utilized their table top space to display
commercial films, successful end-use applications and promote the new
Ti
and AET organization as a
global leader in the OPP films industry.
Ken Gaylor, new Vice President Sales &
Duncan Henshall, Business Director Food